S-Package Solution (representative Won-Oh Lee, www.spackage.co.kr) exhibited ‘AlBeat Power LED’ at the ‘L&D KOREA 2011 (The 2nd International LED & Display Korea)’ held at New EXCO in Daegu, Korea from September 28 to 30.

Power LED improved its thermal problem by using Aluminum with superior thermal conductivity as whole package’s body. It optimized heat design by making heat generated from LED being delivered to the Plate.

S-Package Solution is a venture corporate possessing cutting-edge semiconductor packaging technologies such as Wafer Level Package and CSP(Chip Scale Package). It has been founded in 2002 by professional engineers who have over 10 years career and technique on especially packaging technology of semiconductor processing and manufacturing semiconductor type of sensor and power LED etc.

Meanwhile, in L&D KOREA 2011, co-organized by metropolitan councils like Daegu Metropolitan City and Korea LED Association (KLEDA), whole fields utilizing LED will be covered, not only focusing on LED lightings, but as smart lighting which’s derived from different applications adopted in LED lighting, agricultural lighting, medical lighting, lighting for fishing, car lighting, outdoor lighting, and indoor lighting.

Go to ‘L&D Korea 2011′ Special News Portal

Original post by Mia Eun